TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (NASDAQ: AMKR), a leading outsourced semiconductor packaging and test service provider, today announced the expansion of its collaboration with Cadence Design Systems, Inc. (NASDAQ: CDNS) to streamline semiconductor package verification with the joint development of a package assembly design kit (PADK) for Amkor’s SLIM™ and SWIFT™ advanced fan-out package technologies. As a leader in electronic design automation, Cadence will provide Amkor w
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